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HiSilicon Releases 8K IPTV Solution with ChangHong at IBC2019

HiSilicon releases 8K IPTV solution with its partner Changhong which is a leading STB solution provider. The IPTV solution can support 8K video streaming services powered by Hi3796CV300 8KP120 chipset.

Hisilicon and Jiangsu Cable Deliver Next Generation Smart Home Center

Hisilicon and Jiangsu Cable Delivering Next Generation Smart Home Center with 8K + AI + HomeBus

HiSilicon Empowering SmartHome by Releasing 8K + AI + HomeBus solution

Hisilicon demonstrating an industry first “AI + 8K + HomeBus” solution, from 13th - 17th September, 2019 in Hall 2 A49, RAI, Amsterdam.

HiSilicon Shows Latest 8K AVS3 End-to-End Solution at IBC2019

Hisilicon announces that it will show the industry the first 8K AVS3 end-to-end solution at IBC2019 with its partner Arcvideo Tech which is a leading smart video solution and cloud video service provider.

Embracing New Business Opportunities with HiSilicon 8K TV with AI PQ solution

Hisilicon announces that it will show the industry the first 8K AVS3 end-to-end solution at IBC2019 with its partner Arcvideo Tech which is a leading smart video solution and cloud video service provider.

Defining a New Chapter of Smart Home with 8K + AI + HomeBus

Defining a New Chapter of Smart Home with AI + 8K + HomeBus, the New Immerse Video Experience Era is Coming.

Huawei Launches the latest flagship Kirin 990 and its enhanced 5G version

[Berlin, Germany, September 6, 2019] Richard Yu, CEO of Huawei Technologies Consumer Business Group, delivered a keynote speech entitled "Rethink Evolution" at the IFA, and unveiled the latest flagship Kirin 990 and its enhanced 5G version. As the first-ever 5G SoC, Kirin 990 (5G) enables end users to access superb 5G connectivity, before the comprehensive rollout and commercialization of 5G has been achieved. In order to offer optimal 5G in all scenarios, Kirin 990 (5G) comes packed with cutting-edge performance, energy efficiency, AI computing, and ISP, lifting the smartphone user experience to new heights.

HiSilicon Will Release Industry Leading 8K @120fps Chipset for Smart Home at IBC2019

Hisilicon will demonstrates world-leading “8K+AI” technologies in Hall 2 A49, RAI, Amsterdam from 13th - 17th September, 2019

HiSilicon Empowering Dash Camera Industry by Releasing Hi3556V200 Chipset

HiSilicon launch a new generation of Car-DVR solution based on Hi3556V200. Created for devices that require recording on more clearly of 1440P pixels front + 1080P pixels rear while on driving scene. Hi3556V200 solves the problem of heat dissipation issue that exists for most Car-DVR on market by significantly reducing the power consumption of the chip, and the problem of TF-card life span issue when recording at high stream bit-rate. With the high affection reference design on SDK, customers could faster solution developing and shorter time to market.

HiSilicon Outlines opportunities for Smart Home with 8K+AI chipset solution

HiSilicon outlined its Smart Home chipset solution powered by 8K+AI technologies.

HiSilicon launched solution based on power line communication protocol G.hn.

HiSilicon will show “G.hn- Whole Home Coverage Solution” at Broadcast Asia2019(BCA2019) Singapore, Whole Home Coverage Chipsets Implement High-Speed Interconnections and Full Wi-Fi Coverage for Every Family.

HiSilicon Enabling Smart City and Smart Home with Series PQ+AI Chips and Solutions

HiSilicon release a full series of low-power-consumption and high-performance AI camera chips and solutions at the IFSEC exhibition in the UK. With rich PQ+AI capabilities, these chips cover the AI applications from 8K to 1080P.

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